R&D
고객과 함께 성장하는 레이저 장비 전문 기업
“ 레이저 장비 전문 제조를 위한 핵심 기술 보유로 레이저 응용 기술 확대 ”
연구인력 확대로 적극적 R&D 투자, 공정기술 관련 특허권 보유 90여건
당사 보유 핵심기술
01.
광학설계
- 라인빔 광학계 설계 및 개발
- 결상 광학계 설계 및 개발
- 회전 광학계 설계 및 개발 (Trepanning Optic 외 )
02.
자동화설계
- 초정밀 스테이지 설계
- Roll to Roll 설계 및 개발
- Handler 자동화 설계 및 개발
- Spatter 제거 Unit 설계
03.
제어기술
- 초정밀 스테이지 보정 기술
- 스캐너 연동가공 제어 기술
- On the Fly 고속가공 제어
04.
공정기술
- 이종금속 용접기술
- Chamber形 Suction Unit
- 고출력레이저 절단 및 용접기술
- Anti-Burr 고속가공기술
- 미세, 고속 마킹기술
기술 응용 분야
AMOLED
- Cell Sealing / Repair
- Glass Inner Marking
FLEXIBLE
- Laser Lift Off
- PI / Plastic OLED Cutting
LCD
- LGP Engraving
- Film Cutting
TSP
- Film Cutting
- Patterning
- Glass Cutting
Smart IT
- Micro Soldering
- Camera module Cutting
- FPCB Drilling
분야별 제품스팩
CO2 Laser Cutting System for Glass Separation
1. Product Descriptions
Cutting equipment for Original Glass with the Half/Quarter Cut.
2. Specifications
– Laser : CO2 Laser
– Application : Display Glass (LCD, AMOLED, etc)
– Material Size : Max. 8G
3. Feature
– High Cutting Accuracy
– High Cutting Straightness
– High Cutting Speed
AMOLED Laser Frit Cell Sealing System
1. Product Descriptions
OLED Frit Sealing equipment from outside elements (air & water).
Applied to the key process that influence the efficiency and lifetime
of AMOLED Panel.
2. Specifications
– Laser : IR Laser
– Application : AMOLED Panel
– Material Size : 4.5G, 5.5G, 6G, 8G
3. Feature
– 100% Market share in the world
– Completed the development of large AMOLED Equipment(8G)
Flexible Film Cutting System
Cutting equipment for the Flexible film using a laser Have sales record to A* company
2. Specifications– Work Material : Flexible Display – Material Size : 2~8G
3. Feature– Min. Cutting Radius (scanner process) : R 0.1mm (tolerance ±10%) – Min. Cutting Radius (stage process) : R 1mm@ 30mm/sec (tolerance ±10%) – Accuracy (stage process) : ≤±20um – Accuracy (on the fly process) : ≤±35um – HAZ (POL, PI, Glass Cutting) : ≤±40um
OLED Film Chamfering System
Chamfering equipment for OLED Film using a laser
2. Specifications– Laser : 355nm Pico second Laser – Application : OLED Film – Accuracy : ± 30um – Tact Time : 3.5sec/1panel(1.5inch)
OLED Module/Cell Repair System
Repair equipment for defect part at OLED Module Have sales record to S* company & L* company
2. Specifications– Laser : wavelength(1064nm, 532nm, 355nm) – Application : OLED Module – Material Size : 3~77inch – Repair time : <1sec / 1point
3. Feature– Available response for Curved OLED
Inner Glass Marking System
Marking equipment for ID or Align Key in the LCD or OLED substrate using a laser.
2. Specifications– Laser : UV Laser – Application : LCD or AMOLED Panel
LGP Engraving System
Engraving equipment very fine patterns on the LGP using a laser Have sales record over 200 systems to S* company, L* company, W* company.
2. Specifications– Laser : CO2 Laser – Application : Extrusion, MS, Casting – Material Size : Max 100inch – Processing Speed : 4000 mm/sec
3. Feature– High-speed precision processing – Developed LGP for lighting, Available corresponding thin plate
LGP Serration System
Serration equipment for LGP lateral side using a Laser
2. Specifications– Laser : CO2 Laser – Application : Extrusion, MS, Casting – Material Size : Max 82inch – Processing Speed : 1500 mm/sec
3. Feature– Prevent Hot Spot – Developed LGP for lighting, – Available corresponding thin plate
Pol Film Cutting System
Cutting equipment for POL Film Cutting or POL attached on the Panel.
2. Specifications– Laser : CO2 Laser – Application : POL + Panel or POL – Material Size : 8inch~ 65inch – Tact time : 10sec/1panel(32inch)
3. Feature– Glass No Damage can be processed – Camera Hole Cutting can be processed – Available to selection processing with 1 pass or Multi-pass
Glass Cutting System
Cell or Hole Cutting equipment on the Tempered / non-Tempered glass using a laser Have sales record to A*, B*, T* company
2. Specifications– Laser : Picosecond Laser – Application : Chemically Tempered Glass – Depth of Layer(DOL) : 20um ~ 40um – Processing Speed : 600 mm/sec
3. Feature– Available for Tempered / non-Tempered glass at the same time – Chipping Size : <10um
TSP Film Cutting System (PET, PE, OCA, etc)
Cutting equipment for Touch Film using a laser. Have large quantities sales record to S* company, L*company
2. Specifications– Laser : CO2 Laser – Application : PET, PE, OCA, reinforced Film – Material Size : 500 x 500mm – Processing Speed : 300 mm/sec
3. Feature– On the Fly function – Optimizing the R section, starting point and end point quality – Available to detect 2 sheets and remove Dummy automatically – Available to cut Ear Hole, Home Button, Camera Hole
Laser Patterning System
Patterning equipment for ITO, Ag paste, Ag Nanowire, CNT on the Film/Glass using a laser
2. Specifications– Laser : IR & UV Laser – Application : Film & Glass – Material Size : 500 x 500mm – Processing Speed : 3000 mm/sec
3. Feature– Implementable for fine Pattern – Available to processing Line Patterning & Area Patterning – Optimize the Tact Time with Multi-Head implement
Camera Module Cutting System
Cutting equipment for Camera Module’s Tie Bar using a laser
2. Specifications– Laser : Green or UV Laser – Application : Camera Module
3. Feature– Accuracy : ±50um
UV Drilling System
FPCB Drilling equipment using a laser
2. Specifications– Laser : UV Laser – Application : FPCB
3. Feature– Processing Speed : 200hole/sec – Accuracy : ±14um
Laser De-flash System
Removing Flash Nylon material to meet the dimensional drawings using a CO2 Laser
2. Specifications– Laser : CO2 Laser – Application : Reflection Plate Burr(Resin) Remover – Specification : 0~+< 50um – Tact Time : <10sec
Multi-Cell Foil Welding
-
- 기능 : 전극부와 Tab 간의 용접
– 내부저항 개선 – 상하 접착강도 개선
-
- Scanner 채용 : 고속용접구현
- Spatter 방지 : 밀폐형 Chamber + Suction 구조)
- 비활성가스 Blowing
- 60매 전극 Tab 용접가능 중요 구성
– Laser : 고객 사양에 따름 – 압착 Jig Unit – Isolated 2 Chamber – 3 Axis Motion Unit
- 관련특허 출원 : 2건
Roll to Roll Type
-
- Roll to Roll System : Max speed 30m/min
-
- Scanner speed : 1,000mm/s
- Max Capability : 30매/min (300×300)
